Multilayer Stack with Enhanced Conductivity and Stability

ABSTRACT

An example method includes: (i) depositing an insulating layer on a substrate; (ii) forming a conductive polymer layer on the insulating layer; and (iii) repeating deposition of a respective insulating layer, and formation of a respective conductive polymer layer to form a multilayer stack of respective conductive polymer layers interposed between respective insulating layers. Each respective conductive polymer layer has a respective electrical resistance, such that when the respective conductive polymer layers are connected in parallel to a power source, a resultant electrical resistance of the respective conductive polymer layers is less than each respective electrical resistance.

FIELD

The present disclosure relates generally to enhancing conductivity of apolymer. More particularly the present disclosure relates to stacking uplayers of a conductive polymer interposed between, or separated by,insulating layers to enhance conductivity and achieve a particularconductivity level and a particular electrical resistance level.

BACKGROUND

In examples, a conductive polymer is produced by an emulsionpolymerization method to form an organically soluble conductive polymer.The soluble conductive polymer can then be cast into a film having aparticular electrical conductivity. Electrical conductivity (or specificconductance) is a measure of the film's ability to conduct electricity.Electrical conductivity can be measured in units of Siemens per meter(S/m) or Siemens per centimeter meter (S/cm), for example. Electricalconductivity is the reciprocal of electrical resistivity, which ismeasured in (Ohm·m) or (Ohm·cm). For example, the film of conductivepolymer may have electrical conductivity on the order of 1E-5 S/cm.

Electrical conductivity of the film may be increased by treating thefilm with a conductivity enhancer (e.g., isopropanol). For instance,conductivity of the film made of the conductive polymer may be increasedto approximately 10 S/cm, which amounts to 6 orders of magnitudeincrease from the film before treatment with isopropanol.

The conductive polymer may be brittle and not suitable to someapplications. To make the conductive polymer usable in particularapplications, it is first rendered flexible and compatible with othermaterials by, for example, formulating the conductive polymer inpolyurethane, epoxy, or phenoxy resins, among other example resins.Formulating conductive polymer in a resin may, for example, involvedispersing the conductive polymer in the resin to form a network of theconductive polymer therein.

However, formulating the conductive polymer in the resin reduces ordegrades electrical conductivity of the conductive polymer. Forinstance, electrical conductivity of the conductive polymer may bereduced to lower than 1E-3 S/cm despite treatment with isopropanol. Suchreduction or degradation in electrical conductivity may be undesirable.

It may thus be desirable to have films or layers of a conductive polymerthat are usable in various applications without degradation toelectrical conductivity of the conductive polymer films or layers. It iswith respect to these and other considerations that the disclosure madeherein is presented.

SUMMARY

The present disclosure describes examples that relate to multilayerstack with enhanced conductivity and stability.

In one aspect, the present disclosure describes a method. The methodincludes: (i) depositing an insulating layer on a substrate; (ii)forming a conductive polymer layer on the insulating layer; and (iii)repeating deposition of a respective insulating layer, and formation ofa respective conductive polymer layer to form a multilayer stack ofrespective conductive polymer layers interposed between respectiveinsulating layers. Each respective conductive polymer layer has arespective electrical resistance, such that when the respectiveconductive polymer layers are connected in parallel to a power source, aresultant electrical resistance of the respective conductive polymerlayers is less than each respective electrical resistance.

In another aspect, the present disclosure describes a device. The deviceincludes: a substrate, and a multilayer stack comprising conductivepolymer layers and insulating layers disposed on the substrate disposedon the substrate. The multilayer stack includes a plurality ofconductive polymer layers, each conductive polymer layer beinginterposed between respective insulating layers. Each conductive polymerlayer has a respective electrical resistance, and a number of conductivepolymer layers of the plurality of conductive polymer layers is selectedsuch that when the conductive polymer layers are connected in parallelto a power source, a resultant electrical resistance of the conductivepolymer layers is substantially equal to a predetermined electricalresistance.

In still another aspect, the present disclosure describes a component ofa vehicle such as an aircraft. The component includes a multilayer stackof conductive polymer layers and insulating layers disposed on orproximate to a surface of the component. The multilayer stack includes aplurality of conductive polymer layers, each conductive polymer layerbeing interposed between respective insulating layers. Each conductivepolymer layer has a respective electrical resistance, such that when therespective conductive polymer layers are connected in parallel to apower source coupled to the aircraft, a resultant electrical resistanceof the respective conductive polymer layers is less than each respectiveelectrical resistance.

The foregoing summary is illustrative only and is not intended to be inany way limiting. In addition to the illustrative aspects, embodiments,and features described above, further aspects, embodiments, and featureswill become apparent by reference to the figures and the followingdetailed description.

BRIEF DESCRIPTION OF THE FIGURES

The novel features believed characteristic of the illustrative examplesare set forth in the appended claims. The illustrative examples,however, as well as a preferred mode of use, further objectives anddescriptions thereof, will best be understood by reference to thefollowing detailed description of an illustrative example of the presentdisclosure when read in conjunction with the accompanying Figures.

FIG. 1 illustrates a substrate with an insulating layer formed on thesubstrate to provide a partially-fabricated multilayer stack, inaccordance with an example implementation.

FIG. 2 illustrates a conductive polymer layer formed on the insulatinglayer to provide a partially-fabricated multilayer stack, in accordancewith an example implementation.

FIG. 3 illustrates another insulating layer formed on the conductivepolymer layer to provide a partially-fabricated multilayer stack, inaccordance with an example implementation.

FIG. 4 illustrates electrical contacts formed on edges of the conductivepolymer layer to provide a multilayer stack, in accordance with anexample implementation.

FIG. 5 illustrates a power source coupled to a multilayer stack, inaccordance with an example implementation.

FIG. 6 illustrates a variation of temperature at a particular locationon a multilayer stack as a power source is cycled, in accordance with anexample implementation.

FIG. 7 illustrates a device having a multilayer stack of respectiveconductive polymer layers and respective insulating layers, inaccordance with an example implementation.

FIG. 8 illustrates a component of an aircraft with a multilayer stackdeposited on the component, in accordance to an example implementation.

FIG. 9 is a flowchart of a method for forming a multilayer stack ofconductive polymer layers and insulating layers, in accordance with anexample implementation.

FIG. 10 is a flowchart of additional operations that may be performedwith the method of FIG. 9, in accordance with an example implementation.

FIG. 11 is a flowchart of additional operations that may be performedwith the method of FIG. 9, in accordance with an example implementation.

FIG. 12 is a flowchart of additional operations that may be performedwith the method of FIG. 9, in accordance with an example implementation.

FIG. 13 is a flowchart of additional operations that may be performedwith the method of FIG. 9, in accordance with an example implementation.

FIG. 14 is a flowchart of additional operations that may be performedwith the method of FIG. 9, in accordance with an example implementation.

FIG. 15 is a flowchart of additional operations that may be performedwith the method of FIG. 9, in accordance with an example implementation.

DETAILED DESCRIPTION

Formulating a conductive polymer in an insulating material such as resinreduces or degrades electrical conductivity of the conductive polymerdespite treatment with a conductivity enhancer such as isopropanol(IPA). Such reduction or degradation in electrical conductivity may beundesirable. Within examples described herein is a multilayer stackhaving a conductive polymer layer treated with a conductivity enhancerand “sandwiched” or interposed between two insulating layers. An exampleprocess disclosed herein involves casting and curing a film of aninsulating material such as resin (e.g., polyurethane (PUR)) followed byapplying a coating of conductive polymer. The conductive polymer canthen be treated with a conductivity enhancer to increase electricalconductivity of the conductive polymer layer. The treated conductivepolymer layer may then be dried, and another insulating layer is appliedand cured. This layer-by-layer stack-up provides a protectiveencapsulation of the conductive polymer from the environment andmaintains the level of electrical conductivity of the conductive polymerlayer.

Further, this process allows for forming a multilayer stack ofconductive polymer layers and can lower overall electrical resistance ofthe multilayer stack. In particular, as the number of layers increases,the electrical resistance decreases per Ohm's law. As such, a multilayerstack of conductive polymer layers interposed between insulation layerscan be fabricated to have a particular electrical resistance.

FIGS. 1-5 illustrate stages of fabricating a multilayer stack, inaccordance with an example implementation. The illustrations shown inFIGS. 1-5 are generally shown in cross-sectional views to illustratesequentially formed layers developed to create the multilayer stack. Thelayers can be developed by microfabrication and/or manufacturingtechniques such as, for example, electroplating, photolithography,deposition, and/or evaporation fabrication processes, spin coating,spray coating, roll-to-roll coating, ink jet, direct-write, among otherpossible deposition or forming techniques.

Further, in examples, the various materials of the layers may be formedaccording to patterns using photoresists and/or masks to patternmaterials in particular arrangements. Additionally, electroplatingtechniques can also be employed to coat ends or edges of conductivepolymer layers with electrical contacts (e.g., metallic pads orelectrical leads). For example, an arrangement of conductive materialformed by a deposition and/or photolithography process can be platedwith a metallic material to create a conductive electrical contact.

The dimensions, including relative thicknesses and widths, of thevarious layers illustrated and described in connection with FIGS. 1-5 tocreate a multilayer stack are not illustrated to scale. Rather, thedrawings in FIGS. 1-5 schematically illustrate the ordering of thevarious layers for purposes of explanation only.

FIG. 1 illustrates a substrate 100 with an insulating layer 102 formedon the substrate 100 to provide a partially-fabricated multilayer stack104, in accordance with an example implementation. In some examples, theinsulating layer 102 can adhere to the substrate 100. In examples, theinsulating layer 102 can be configured to facilitate forming aconductive polymer layer thereon, such that the conductive polymer layeradheres to the insulating layer 102.

As examples, the substrate 100 can be made out of an epoxy resin, acomposite structural material (e.g., of a wing, blade, or any componentof an aircraft), thermoplastic resin, thermoset material, apolycarbonate material, etc. The substrate 100 can be cleaned beforeforming the insulating layer 102. The substrate 100 may be cleaned in avariety of ways such as soaking in a first fluid, rinsing with a secondfluid, and drying with a gas. In some examples, the first fluid caninclude a solvent, such as acetone. Moreover, in some examples, thesecond fluid can include isopropyl alcohol. Further, in some examples,the gas can include nitrogen. Rinsing may be performed in a varietyways, such as soaking in a bath in a tank, an automated spray, manuallyvia a squirt bottle, etc.

In examples, the substrate 100 can be baked before forming theinsulating layer 102. The substrate 100 may be baked at a particulartemperature for a time period. For example, the temperature can be 90degrees Celsius (C) and the time period may be 2 minutes. In otherexamples, the substrate 100 can be plasma cleaned before forming theinsulating layer 102. The substrate 100 may be plasma-cleaned at aparticular power level for a time period.

The insulating layer 102 can be formed, for example, of a resinmaterial. Example resin materials include epoxy, thermoplastic resins,phenolic resins, or silicone resins, which are characterized in beingdurable and operable under elevated temperatures. It may be desirable toconfigure the insulating layer 102 of a thermostable resin material. Asa specific example, the insulating layer 102 can be made of PUR, whichis a polymer composed of organic units joined by carbamate (urethane)links. PUR can be a thermosetting polymer or a thermoplastic polymer.PUR can be formed by reacting a di- or poly-isocyanate with a polyol.PUR is described herein as an example for illustration, and other typesof resin could be used to make the insulating layer 102.

The insulating layer 102 can be deposited on the substrate 100 in avariety of ways such as brushing, painting, patterning, printing, anyadditive manufacturing method, etc. In examples, after forming theinsulating layer 102 on the substrate 100, the insulating layer 102 maybe cured (e.g., cured at a particular temperature such as 70 C). Curingmay involve toughening or hardening of the insulating material by heator chemical additives, among other processes. Curing can be partial orcan be full depending on the application and implementation. Theinsulating layer 102 can have a surface 106 configured to receive aconductive polymer layer as described next.

FIG. 2 illustrates a conductive polymer layer 108 formed on theinsulating layer 102 to provide a partially-fabricated multilayer stack110, in accordance with an example implementation. The conductivepolymer layer 108 can be made of any of several conductive polymers. Forexample, the conductive polymer layer 108 can be made of polyaniline(PANT), poly(ethylenedioxythiophene) (PEDOT), poly(styrenesulfonate)(PSS), dodecylbenzene sulfonic acid (DBSA), Dinonylnaphthylsulfonic acid(DNNSA), Polypyrrole (PPy), mixtures thereof, or salts thereof. In otherexamples, the conductive polymer layer 108 could be made of graphenepaint, carbon nanotubes paint, carbon black paint, conductive oxides, orconductive paints containing metal or metallic particles.

In examples, the conductive polymer layer 108 could be made of anintrinsically conducting polymer (ICP). ICPs include synthetic organicpolymers configured to conduct electricity. In other examples, theconductive polymer layer 108 could be made of an extrinsicallyconducting polymer. An extrinsically conducting polymer is obtained byadding specific additives (e.g., metallic particle fillers) to anaturally insulating polymer to render such an insulting polymerelectrically conductive.

As a specific example for illustration, the conductive polymer layer 108can be made of Polyaniline-Dinonylnaphthalene sulfonic acid(PANI-DNNSA). PANI is a conducting polymer of the semi-flexible rodpolymer family, and is characterized by high electrical conductivity.DNNSA is an organic chemical, e.g., an aryl sulfonic acid. In examples,DNNSA has a melting point of 259.5 C and a boiling point of 600.4 C.DNNSA is stable above 100 C. DNNSA can be prepared by reaction ofnaphthalene with nonene, yielding diisononylnaphthalene.Diisononylnaphthalene then undergoes sulfonation. DNNSA can be added toa PANI fluid to increase the electrical conductivity of the fluid.PANI-DNNSA is used herein as example; however, any other conductivepolymer, such as the conductive polymers, mentioned above could be used.

In an example, the conductive polymer can be produced by an emulsionpolymerization method to form an organically soluble conductive polymer.The organically soluble conductive polymer can then be mixed withtoluene, for example. Toluene is a colorless, water-insoluble liquidthat operates as a solvent. Toluene is a mono-substituted benzenederivative, having a CH₃ group attached to a phenyl group. In thisexample, the conductive polymer in toluene may be applied or depositedto the surface 106 of the insulating layer 102 to form the conductivepolymer layer 108 shown in FIG. 2.

In an example, the conductive polymer layer 108 in toluene may bebrushed on the surface 106 of the insulating layer 102 to form a uniformlayer thereon so as to have consistent electrical resistance over thesubstrate 100. Other depositing techniques could be used to form theconductive polymer layer 108 on the insulating layer 102. For instance,the conductive polymer layer 108 may be formed by a microfabricationprocess such as chemical vapor deposition, spin coating, spray coating,roll-to-roll coating, ink jet printing, patterning, direct-write. Forexample, the conductive polymer material may be spin coated by placingthe conductive polymer material on the partially-fabricated multilayerstack 104, applying a spread cycle, applying a spin cycle, and applyinga deceleration cycle.

In examples, the conductive polymer layer 108 may be deposited onto theinsulating layer 102 with a substantially uniform thickness such that asurface of the conductive polymer layer 108 is substantially flat. Insome examples, the conductive polymer layer 108 can be configured as aconformal coat.

An adhesion promoter can be applied to the surface 106 of the insulatinglayer 102 before the conductive polymer layer 108 is formed. With suchan arrangement, adhesion of the conductive polymer layer 108 to theinsulating layer 102 may be improved. In some examples, the adhesionpromoter can comprise 3-methacryloyloxypropyltrimethoxysilane, and inother examples, the adhesion promoter may comprise hexamethyldisilazane(HDMS), which can enhance adhesion of the conductive polymer layer 108to the insulating layer 102. Other adhesion promoters are possible aswell.

The adhesion promoter may be applied in a variety of ways such as spincoating at a particular rate (e.g., 3000 rpm), baking at a temperaturefor a first time period, rinsing with a fluid (e.g., IPA), and baking atthe temperature for a second time period. In such examples, applying theadhesion promoter by spin coating may involve accelerating and/ordecelerating the partially-fabricated multilayer stack 104. Otherapplication methods of the adhesion promoter are possible. Moreover, thepartially-fabricated multilayer stack 104 can be cleaned (e.g., viarinsing or plasma cleaning) before applying the adhesion promoter to thesurface 106 of the insulating layer 102.

The surface 106 of the insulating layer 102 can be treated, such thatthe conductive polymer layer 108 bonds to the treated surface duringformation of the conductive polymer layer 108. The surface 106 may betreated in a variety of ways such as by etching using an inductivelycoupled plasma.

The conductive polymer layer 108 can be dried at a particulartemperature, and treated with a conductivity enhancer to enhanceelectrical conductivity of the conductive polymer layer 108. An exampleconductivity enhancer can include a morphology enhancer such as IPA. Inthis example, to enhance electrical conductivity of the conductivepolymer layer 108, the conductive polymer layer 108 may be rinsedseveral times with IPA. The conductive polymer layer 108 (e.g.,PANI-DNNSA) can be treated with IPA using other methods. In otherexamples, the conductive polymer layer 108 can be treated with a bandmodifier to enhance electron hole mobility, and thus enhance electricalconductivity of the conductive polymer layer 108. Other conductivityenhancers could be used as well.

As described above, the conductive polymer layer 108 is formed on theinsulating layer 102 such that the conductive polymer layer 108 adheresto the insulating layer 102. Because the insulating layer 102 isinterposed between the conductive polymer layer 108 and the substrate100, the conductive polymer layer 108 need not be configured to adhereto a material of the substrate 100. With this configuration, theconductive polymer layer 108 is not formulated in a resin, and thus theelectrical conductivity of the conductive polymer layer 108, which maybe enhanced by treatment with a conductivity enhancer, is not degraded.

In examples, the conductive polymer layer 108 may have a thickness lessthan 10 one thousandth of an inch (i.e., less than 10 mil.). However,other thicknesses are possible. The conductive polymer layer 108 canhave a surface 112 configured to receive another insulating layer asdescribed next.

FIG. 3 illustrates another insulating layer 114 formed on the conductivepolymer layer 108 to provide a partially-fabricated multilayer stack116, in accordance with an example implementation. The insulating layer114 can comprise another resin layer similar to the insulating layer102. In an example, the insulating layer 114 may be diluted with asolvent such as dimethylcarbonate to give a 20% mass/mass (w/w)solution.

The insulating layer 114 can be applied to the surface 112 of theconductive polymer layer 108 in a similar manner to applying theinsulating layer 102 to the substrate 100. As such, the insulating layer114 may be spin coated, brushed, patterned, printed, etc. on the surface112. An adhesion promoter can be applied to the surface 112 tofacilitate adhesion of the insulating layer 114 to the surface 112 ofthe conductive polymer layer 108. The insulating layer 114 can then becured at a particular temperature (e.g., 70 C).

FIG. 4 illustrates electrical contacts 118, 120 formed on edges of theconductive polymer layer 108 to provide a multilayer stack 122, inaccordance with an example implementation. The electrical contact 118can be formed at a first lateral edge or end of the conductive polymerlayer 108, whereas the electrical contact 120 can be formed at a secondlateral edge or end, opposite the first lateral edge or end, of theconductive polymer layer 108.

Each of the electrical contacts 118, 120 can be formed independently asa piece of electrically conductive material made of a metal. Forinstance, the electrical contacts 118, 120 could be configured as metal(e.g., silver or gold alloy) pads. However, the electrical contacts 118,120 could take other forms such as an electrical lead or a wire.

The electrical contacts 118, 120 may be sprayed, brushed, patterned(printed) or deposited at the lateral ends or edges of the conductivepolymer layer 108 via other techniques. The electrical contacts 118, 120can then be used to connect a power source (direct current oralternating current source) to the conductive polymer layer 108. Inexamples, electrical connections between the electrical contacts 118,120 and the power source could be made using conductive inks or metalsapplied with evaporation or cold-spray techniques.

FIG. 5 illustrates a power source 124 coupled to the multilayer stack122, in accordance with an example implementation. The power source 124is depicted as an alternating current (AC) source; however, other typesof power sources could be used.

With this configuration, the conductive polymer layer 108 can operate asan electrical resistance. In other words, the conductive polymer layer108 has a particular electrical conductivity based on the amount ofconductive material in the conductive polymer layer 108, a thickness ofthe conductive polymer layer 108, and treatment with a conductivityenhancer. As electric current flows through the conductive polymer layer108, heat is generated. In particular, due to the electrical resistanceof the conductive polymer layer 108 (i.e., resistance to motion ofelectrons), electrons of the electric current bump into atoms within theconductive polymer layer 108, and thus some of the kinetic energy of theelectrons is transferred to the atoms of the conductive polymer layer108 as thermal energy. This thermal energy causes the conductive polymerlayer 108 to be heated. As such, electric power from the power source124 is dissipated as thermal energy from the conductive polymer layer108.

In a specific experimental implementation, the substrate 100 is made ofa 3 inches by 5 inches polycarbonate substrate. The insulating layer 102is then applied as a PUR coating via a brush to the polycarbonatesubstrate, and the PUR coating is then cured at 70 degrees C. PANI-DNNSAin toluene is then applied via a brush to the surface of the PUR coatingto form the conductive polymer layer 108, and then the PANI-DNNSA layeris dried at 70 degrees C. Another layer of PUR (diluted withdimethylcarbonate to give a 20% weight per weight (% w/w) solution) isthen applied to the surface of the PANI-DNNSA layer to form theinsulating layer 114, and is then cured at 70 degrees C. Silver contactsare then applied to edges of the PANI-DNNSA layer. With this specificimplementation, the PANI-DNNSA layer may have or may cause an electricalresistance of approximately 1,600 ohms between the silver contacts.

With this specific experimental implementation, the multilayer stack isconnected to an AC voltage power source to test its electrical heatingcapability. The voltage applied is 94.5 volts and the current measuredis 60.84 mill amperes, thus yielding a 6 watt heater. These numbers andconfigurations are examples for illustration only. Other dimensions,sizes, and techniques could be used based on an application in which themultilayer stack is to be used and the electrical resistance to begenerated.

FIG. 6 illustrates a variation of temperature at a particular locationon the multilayer stack as a power source is cycled, in accordance to anexample implementation. In particular, FIG. 6 depicts a plot 126 withtemperature in Celsius represented on the y-axis and absolute time onthe x-axis. Curve 128 illustrates temperature variation at theparticular location as voltage of the power source is cycled on and offat 20 second intervals and the temperature monitored with a thermalcamera. No degradation is detected over a two hour cycling period. Inother words, the temperature level reached for each cycle is not variedor reduced over time.

This layer-by-layer stack-up shown in FIGS. 1-5 provides severaladvantages. For example, with the configuration shown in FIG. 5, theconductive polymer layer 108 is provided in a protective encapsulationbetween two insulating layers 102, 114 to protect the conductive polymerlayer 108 from its environment. Also, with this configuration, theconductive polymer layer 108 is not formulated in a resin, but is ratherinterposed formed as an independent polymer layer between the twoinsulating layers 102, 114. Thus, if the conductive polymer layer 108 istreated by a conductive enhancer to increase its electricalconductivity, the enhanced electrical conductivity is not degradedbecause the conductive polymer layer 108 is no formulated in a resin.

Moreover, as mentioned above, the conductive polymer layer 108 isadhered to the insulating layers 102, 114 rather than the substrate 100,and thus the conductive polymer layer 108 need not be configured toadhere to a material of the substrate 100. In other words, theconductive polymer layer 108 is configured to adhere to the material ofthe insulating layers 102, 114, whereas the insulating layers 102, 114are configured to adhere to the material of the substrate 100. As such,the chemical composition and processing of the conductive polymer layer108 may be simplified because the conductive polymer layer 108 need nothave chemical formulations that facilitate adhesion to the substrate100.

Further, the multilayer stack 122 represents a modular stack-up that canbe repeated to reduce electrical resistance level to a particular orpredetermined electrical resistance. FIG. 7 illustrates a device 129having a multilayer stack of respective conductive polymer layers andrespective insulating layers, in accordance with an exampleimplementation. The multilayer stack of the device 129 includes severalmodule multilayer stacks similar to the multilayer stack 122. In otherwords, several multilayer stacks similar to the multilayer stack 122 canbe stacked. As shown in FIG. 7, in addition to the multilayer stack 122,other multilayer stacks could be added to achieve a particularelectrical resistance. For instance, multilayer stack 130 could bestacked above the multilayer stack 122 to achieve a lower electricalresistance as described below. The multilayer stack 130 includes aconductive polymer layer 132 “sandwiched” or interposed between theinsulating layer 114 and an insulating layer 136.

The conductive polymer layer 132 may have electrical contacts 138, 140formed on edges of the conductive polymer layer 132. The electricalcontacts 138, 140 may be similar to the electrical contact 118, 120. Inexamples, electrical connections can be made between the electricalcontacts 138, 140 and the power source 124 using conductive inks ormetals applied with evaporation or cold-spray technologies.

With the configuration shown in FIG. 7, the conductive polymer layer 108and the conductive polymer layer 132 operate as two electricalresistances that are connected in parallel to the power source 124. Assuch, a total or resultant resistance R_(t) of the conductive polymerlayer 108 and the conductive polymer layer 132 can be calculated usingOhm's law as follows:

$\begin{matrix}{\frac{1}{R_{t}} = {\frac{1}{R_{1}} + \frac{1}{R_{2}}}} & (1)\end{matrix}$

where R₁ is the electrical resistance of the conductive polymer layer108 and R₂ is the electrical resistance of the conductive polymer layer132. For example, if R₁ is 1,600 Ohms and R₂ is 1,600 Ohms, then R_(t)can be calculated as 800 Ohms, which is half the electrical resistanceof R₁ or R₂.

By stacking more multilayer stacks similar to the multilayer stack 130,the total or resultant electrical resistance can further be reduced. Forexample, a multilayer stack 142 could be stacked above the multilayerstack 130. The multilayer stack 142 includes a conductive polymer layer144 “sandwiched” or interposed between the insulating layer 136 of themultilayer stack 130 and an insulating layer 148. The insulating layers102, 114, 136, and 148 could be referred to as respective insulatinglayers to indicate that the insulating layers are separate and can beformed subsequent to each other. For instance, the insulating layer 114can be formed subsequent to forming the insulating layer 102; theinsulating layer 136 can be formed subsequent to forming the insulatinglayer 114; and the insulating layer 148 can be formed subsequent toforming the insulating layer 136.

The conductive polymer layer 144 may have electrical contacts 150, 152formed on edges of the conductive polymer layer 144. The electricalcontacts 150, 152 may be similar to the electrical contact 118, 120 andthe electrical contacts 138, 140. In examples, electrical connectionscan be made between the electrical contacts 150, 152 and the powersource 124 using conductive inks or metals applied with evaporation orcold-spray technologies.

With the configuration shown in FIG. 7, the conductive polymer layer108, the conductive polymer layer 132, and the conductive polymer layer144 operate as three electrical resistances that are connected inparallel to the power source 124. As such, the total or resultantresistance R_(t) of the conductive polymer layer 108, the conductivepolymer layer 132, and the conductive polymer layer 144 can becalculated using Ohm's law as follows:

$\begin{matrix}{\frac{1}{R_{t}} = {\frac{1}{R_{1}} + \frac{1}{R_{2}} + \frac{1}{R_{3}}}} & (2)\end{matrix}$

where R₃ is the electrical resistance of the conductive polymer layer144. For example, if R₁=R₂=R₃=1,600 Ohms, then R_(t) can be calculatedby equation (2) as approximately 533.33 Ohms, which is one third theelectrical resistance of R₁, R₂, or R₃.

Thus, with this configuration, a predetermined resultant electricalresistance can be achieved by stacking more multilayer stacks. In otherwords the steps of depositing an insulating layer and forming aconductive polymer layer can be repeated to add more multilayer stacksto cause the device 129 to have the predetermined resultant electricalresistance when the power source 124 is connected thereto.

Adding more multilayer stacks is depicted schematically in Figure bydots 154. More multilayer stacks can be added on top of the multilayerstack 142 until a predetermined electrical resistance or predeterminedelectrical conductivity is achieved. As the number of multilayer stacksincreases, the overall resultant electrical resistance decreases perOhm's law:

$\begin{matrix}{\frac{1}{R_{t}} = {\frac{1}{R_{1}} + \frac{1}{R_{2}} + {\frac{1}{R_{3}}\ldots \frac{1}{R_{n}}}}} & (3)\end{matrix}$

where R_(t) is the total or resultant resistance and R₁ . . . R_(n) arethe resistances of the individual multilayer stacks 122, 130, 142 . . .etc. The resultant resistance is less than each respective electricalresistance R₁ . . . R_(n).

As such, the multilayer stacks 122, 130, 142 shown in FIG. 7 comprise aplurality of conductive polymer layers 108, 132, 144 sandwiched orinterposed between insulating layers 102, 114, 136, 148. Thisconfiguration enables using multiple conductive polymer layers ratherthan a single thick conductive polymer layer. A thin conductive polymerlayer is easier to cast into uniform-thickness layer compared to a thickconductive polymer layer. Further, a thin conductive polymer layer ismore flexible and has less electric resistance compared to a thickconductive polymer layer. The configuration allows for tuning electricalresistance and electrical conductivity. By adding more stacks,electrical resistance is decreased and electrical conductivity isincreased, and vice versa.

As described above, the device 129 can be configured to have differentresistivity, and thus different amounts of heat generated, at differentlocations of the device 129 (e.g., at different locations on thesubstrate 100). For example, a different number of layers can be used atdifferent locations. Having more conductive polymer layers at onelocation may indicate that the electrical resistance at that locationcan be lower than a respective electrical resistance at a differentlocation having fewer conductive polymer layers. As a result of usingdifferent number of layers at different locations, a heating gradientcan be generated across the substrate 100. Such arrangement can beimplemented by patterning (e.g., printing) a different number of layersat various locations to enable some locations to be hotter than others.

In another example, the same number of layers can be used across thedevice 129; however, different conductive polymer materials havingdifferent electrical conductivities can be used at different locationsto provide different electrical resistance. As a result, differentelectrical resistance can be generated at different locations of thedevice 129 and a heating gradient can be generated, e.g., to generate adifferent amount of heat at different locations of the device 129.

In another example, a thickness of a conductive polymer layer at onelocation of the device 129 may be different than a respective thicknessof a conductive layer at another location. The different thickness canindicate different electrical conductivity and different electricalresistances at different locations of the device 129. In anotherexample, the conductive polymer layers at one location can be treated bya conductivity enhancer while conductive polymer layers at anotherlocation might not be treated with, or may be treated with a differentconductivity enhancer. Thus, several techniques can be used to modifythe conductivity and resistivity over the substrate 100 including usingdifferent number of layers, different materials for the conductivepolymer layers, different thicknesses for the conductive polymer layers,using a conductivity enhancer at some locations while using no or adifferent conductivity enhancer at other locations, among other possibletechniques.

Further, the device 129 can be configured to as an addressable matrix ofconductive polymer layers to selectively activate a subset of conductivepolymer layers as desired. For example, electrical connections can bemade between the electrical contacts of the conductive polymer layersand the power source 124 using independently actuatable switches. Forinstance, a controller of the device 129 may be coupled to the switchesthat connect individual electrical contacts (e.g., the electricalcontacts 118, 120, 13, 140, 150, 152, etc.) to the power source 124. Thecontroller may then activate a particular number of switches to connecta particular number of conductive polymer layers to the power source 124and achieve a predetermined or a target electrical resistance. If moreswitches, and thus more conductive polymer layers, are activated, then alower electrical resistance and a lower amount of heat are generatedcompared to when fewer switches are activated.

In some examples, an encapsulation layer or encapsulation package 155may be formed about the device 129. The encapsulation package 155 canprovide protection to the device 129 from its environment. In anexample, the encapsulation package 155 may be configured as a conformalinsulating coating of polyurethane, polyimide, polyester, or epoxy thatis applied to a surface of the multilayer stack by spray, dip coating,screen printing, etc. The encapsulation package 155 can then be curedvia ultraviolet light or may be thermally cured. In another example, theencapsulation package 155 can comprise a polymer film (e.g.,polyurethane, polyimide, polyester, etc.) that is to a surface of themultilayer stack using a pressure sensitive adhesive that bonds to thesurface of the multilayer stack. These examples are for illustrationonly and other materials and configuration are possible for theencapsulation package 155.

In the implementation described above, and shown in FIGS. 1-5 and 7, thesubstrate 100 is shown to be flat. However, this is not meant to belimiting. In examples, the substrate could be configured to benon-flexible and flat; however, in other examples, the substrate couldbe flexible and form a curved surface upon which the various otherlayers are deposited.

The multilayer stack, similar to the multilayer stack of the device 129shown in FIG. 7, could be used in a variety of applications. As anexample application, the multilayer stack could be used for de-icing ofa component (e.g., wing, blade, or any other part) of an aircraft,rotorcraft, wind turbine, etc. The substrate (e.g., the substrate 100)in this example could be a composite structure of the component of theaircraft, rotor craft, wind turbine, etc. The various layers of themultilayer stack could then be printed on the composite structure of thecomponent of the aircraft.

FIG. 8 illustrates a component 156 of an aircraft with a multilayerstack 158 deposited on or proximate to a surface 159 of the component156, in accordance to an example implementation. The component 156 ofthe aircraft may, for example, represent a wing, a blade, or any othercomponent of an aircraft. When a power source is connected to theelectrical contacts of the conductive polymer layers of the multilayerstack 158, heat is generated for de-icing (i.e., melt any ice or snowaccumulated about the component 156) or anti-icing (i.e., prevent icefrom forming on the component 156). Distinct layers of the multilayerstacks 158 are not shown in FIG. 8 to reduce visual clutter in thedrawing. However, it should be understood that the multilayer stack 158is similar to the multilayer stack of the device 129 shown in FIG. 7.

In examples, the multilayer stack 158 could be deposited on the surface159 of the component 156. In these examples, other protective layerscould be deposited on top of the multilayer stack 158 for environmentalprotection and durability. In other examples, the multilayer stack 158may be disposed within the component 156 proximate to the surface of thecomponent 156, e.g., within a predetermined distance from the surface159, so as to heat the surface of the component 156 and cause the ice tomelt. In an example, the predetermined distance could range between 0.1millimeter and 5 millimeter depending on thermal conductivity of theprotective layers that separate the multilayer stack 158 from thesurface of the component 156. By being proximate to the surface of thecomponent 156, a lesser amount of heat can melt ice or prevent ice fromforming, compared to a configuration where the multilayer stack 158 isdisposed deeper within the component 156 away from its surface.

In examples, some portions of the component 156 may be more susceptibleto icing than others, and in these examples any of the techniquesdescribed above could be used to vary the electrical resistance and theamount of heat generated at various locations on the on the component156. For instance, if ice is melted off a leading edge 160 of thecomponent 156, the ice could then move and refreeze at a trailing edge162 of the airfoil (e.g., wing or blade). In this example, it may bedesirable to have larger electric resistance at the leading edge 160compared to the trailing edge 162, and thus more heat would be generatedat the leading edge 160. As mentioned above, such variation inelectrical resistance could be achieved by using a different number ofconductive polymer layers, different materials for the conductivepolymer layers, different thicknesses for the conductive polymer layers,or using a conductivity enhancer at one location while using no or adifferent conductivity enhancer at another location. As such, ice can bemelted at the leading edge 160 rather than being allowed to move to andrefreeze at the trailing edge 162.

Additionally or alternatively, the multilayer stack could be used fordissipating lightning strikes that impact an aircraft. As mentionedabove with respect to FIG. 8, the substrate (e.g., the substrate 100)could be a composite structure of the aircraft. The various layers ofthe multilayer stack could then be deposited at particular locations ofthe aircraft (e.g., at the wing tips, tail, nose, etc.) where alightning strike can occur.

The electrical contacts of the conductive polymer layers of themultilayer stacks could be coupled to electrodes disposed at theparticular locations of the aircraft where a lightning may impact theaircraft (e.g., at the nose, wing tips, tails, etc.). The conductivepolymer layers could then form a conductive path that electricallyconnects a portion of the aircraft where the lightning strike impactsthe aircraft to another location of the aircraft where the electricalcharge of the lightning strike is discharged. In other words, theelectric current generated by the lightning strike could be guided bythe conductive polymer layers from one location of the aircraft wherethe lightning strike impacts the aircraft to another location to bedischarged.

The electrical resistance of the conductive polymer layers can cause theelectrical charge of the lightning strike to be dissipated as heatgenerated from the electric current generated by the lightning strikepassing through the conductive polymer layers. In examples, if somelayers of the multilayer stacks are affected by the heat generated orthe electric current of the lightning strike, the multilayer stack canbe repaired by depositing new layers to restore expected performance(e.g., the level of electrical conductivity or electrical resistanceexpected from the multilayer stack).

The multilayer stack could also be used for shielding electroniccomponents from electromagnetic interference (EMI). For instance, insome applications, electronic components (e.g., circuit boards) may bedisposed within a housing. To shield the electronic components from EMI,the housing could be made of a plastic material configured to be thesubstrate (e.g., the substrate 100) of the multilayer stack.

Electromagnetic waves surrounding the housing could generate an electriccurrent in the conductive polymer layers, and thus the electromagneticenergy of the electromagnetic waves is dissipated as heat generated bythe conductive polymer layers. Further, in this example, the insulatinglayers of the multilayer stack operate as insulators that precludeelectromagnetic waves from penetrating the housing. As such, theconductive polymer layers dissipate the electromagnetic energy, whereasthe insulating layers preclude the electromagnetic waves frompenetrating the housing, and thus the electronic components within thehousing are protected from EMI.

FIG. 9 is a flowchart of a method 164 for forming a multilayer stack ofconductive polymer layers and insulating layers, in accordance with anexample implementation. The method 164 presents an example of a methodthat could be used to form a multilayer stack of conductive polymerlayers interposed between respective insulating layers, such as themultilayers stack of the device 129, for example. The method 164 caninclude one or more operations, functions, or actions as illustrated byone or more of blocks 166-184. Although the blocks are illustrated in asequential order, these blocks may also be performed in parallel, and/orin a different order than those described herein. Also, the variousblocks can be combined into fewer blocks, divided into additionalblocks, and/or removed based upon the desired implementation. It shouldbe understood that for this and other processes and methods disclosedherein, flowcharts show functionality and operation of one possibleimplementation of present examples. Alternative implementations areincluded within the scope of the examples of the present disclosure inwhich functions may be executed out of order from that shown ordiscussed, including substantially concurrent or in reverse order,depending on the functionality involved, as would be understood by thosereasonably skilled in the art

At block 166, the method 164 includes depositing an insulating layer(e.g., the insulating layer 102) on a substrate (e.g., the substrate100).

At block 168, the method 164 includes forming a conductive polymer layer(e.g., the conductive polymer layer 108) on the insulating layer (e.g.,the insulating layer 102).

At block 170, the method 164 includes repeating deposition of arespective insulating layer, and formation of a respective conductivepolymer layer to form a multilayer stack of respective conductivepolymer layers interposed between respective insulating layers (e.g.,forming the conductive polymer layers 132, 144 interposed between theinsulating layers 114, 136 and between the insulating layers 136, 148 toform the multilayer stack of the device 129 shown in FIG. 7). Eachrespective conductive polymer layer has a respective electricalresistance, such that when the respective conductive polymer layers areconnected in parallel to a power source (e.g., the power source 124), aresultant electrical resistance of the respective conductive polymerlayers is less than each respective electrical resistance.

The operations many include forming the conductive polymer layer toinclude an intrinsic or extrinsic conductive polymer, or a mixturethereof. The operation of depositing the insulating layer may includedepositing a resin layer including polyurethane, epoxy, thermoplastic,phenolic, or silicone material. Further, the operation of forming theconductive polymer layer may include forming a layer of PANI-DNNSA,PEDOT-PSS, PANI-DBSA, polypyrrole, graphene paint, carbon nanotubespaint, carbon black, conductive oxide, or metallic particles.

FIG. 10 is a flowchart of additional operations that may be executed andperformed with the method 164, in accordance with an exampleimplementation. At block 172, operations include repeating thedeposition of the respective insulating layer and the formation of therespective conductive layer until the resultant electrical resistance issubstantially equal to a predetermined electrical resistance (e.g.,within a percentage such as 1-3% of a target electrical resistance).

FIG. 11 is a flowchart of additional operations that may be executed andperformed with the method 164, in accordance with an exampleimplementation. At block 174, operations include forming the multilayerstack to include each respective conductive polymer layer interfacingwith two insulating layers, one insulating layer on each side of therespective conductive polymer layer (e.g., the conductive polymer layer108 interfacing with the insulating layers 102, 114, the conductivepolymer layer 132 interfacing with the insulating layers 114, 136, andthe conductive polymer layer 144 interfacing with the insulating layers136, 148).

FIG. 12 is a flowchart of additional operations that may be executed andperformed with the method 164, in accordance with an exampleimplementation. At block 176, operations include treating the respectiveconductive polymer layers with a conductivity enhancer to enhanceelectrical conductivity of the respective conductive polymer layers. Forexample, treating the respective conductive polymer layers with theconductivity enhancer comprises treating the respective conductivepolymer layers with IPA. In other examples, the respective conductivepolymer layers may be treated with a band modifier to enhance electronhole mobility, and thus enhance electrical conductivity of therespective conductive polymer layers.

FIG. 13 is a flowchart of additional operations that can be executed andperformed with the method 164, in accordance with an exampleimplementation. At block 178, operations include forming a firstelectrical contact (e.g., first electrical contacts 118, 138, 150) on afirst edge of each conductive polymer layer, and at block 180 operationsinclude forming a second electrical contact (e.g., second electricalcontacts 120, 140, 152) on a second edge of each conductive polymerlayer. The first electrical contacts and the second electrical contactsof the conductive polymer layers facilitate connecting the conductivepolymer layers to the power source.

FIG. 14 is a flowchart of additional operations that can be executed andperformed with the method 164, in accordance with an exampleimplementation. At block 182, operations include curing the insulatinglayer prior to forming the conductive polymer layer. Curing can bepartial or can be full depending on the application and implementation.

FIG. 15 is a flowchart of additional operations that may be executed andperformed with the method 164, in accordance with an exampleimplementation. At block 184, the operations of repeating deposition ofa respective insulating layer, and formation of a respective conductivepolymer layer to form a multilayer stack may include forming themultilayer stack to modify electrical resistivity over the substratewhen the conductive polymer layers are connected in parallel to thepower source. For example, forming the multilayer stack to modify theelectrical resistivity over the substrate may include depositing adifferent number of layers at different locations on the substrate. Inanother example, forming the multilayer stack to modify the electricalresistivity over the substrate may include depositing conductive polymerlayers having a different conductive polymer at different locations onthe substrate. In another example, forming the multilayer stack tomodify the electrical resistivity over the substrate may includedepositing conductive polymer layers having different thicknesses atdifferent locations on the substrate. In another example, conductivelayers can selectively be treated with a conductivity enhancer whileothers might not be treated with a conductivity enhancer so as to varyelectrical conductivity and resistivity across the substrate.

The detailed description above describes various features and operationsof the disclosed systems with reference to the accompanying figures. Theillustrative implementations described herein are not meant to belimiting. Certain aspects of the disclosed systems can be arranged andcombined in a wide variety of different configurations, all of which arecontemplated herein.

Further, unless context suggests otherwise, the features illustrated ineach of the figures may be used in combination with one another. Thus,the figures should be generally viewed as component aspects of one ormore overall implementations, with the understanding that not allillustrated features are necessary for each implementation.

Additionally, any enumeration of elements, blocks, or steps in thisspecification or the claims is for purposes of clarity. Thus, suchenumeration should not be interpreted to require or imply that theseelements, blocks, or steps adhere to a particular arrangement or arecarried out in a particular order.

Further, devices or systems may be used or configured to performfunctions presented in the figures. In some instances, components of thedevices and/or systems may be configured to perform the functions suchthat the components are actually configured and structured (withhardware and/or software) to enable such performance. In other examples,components of the devices and/or systems may be arranged to be adaptedto, capable of, or suited for performing the functions, such as whenoperated in a specific manner.

By the term “substantially” it is meant that the recited characteristic,parameter, or value need not be achieved exactly, but that deviations orvariations, including for example, tolerances, measurement error,measurement accuracy limitations and other factors known to skill in theart, may occur in amounts that do not preclude the effect thecharacteristic was intended to provide.

The arrangements described herein are for purposes of example only. Assuch, those skilled in the art will appreciate that other arrangementsand other elements (e.g., machines, interfaces, operations, orders, andgroupings of operations, etc.) can be used instead, and some elementsmay be omitted altogether according to the desired results. Further,many of the elements that are described are functional entities that maybe implemented as discrete or distributed components or in conjunctionwith other components, in any suitable combination and location.

While various aspects and implementations have been disclosed herein,other aspects and implementations will be apparent to those skilled inthe art. The various aspects and implementations disclosed herein arefor purposes of illustration and are not intended to be limiting, withthe true scope being indicated by the following claims, along with thefull scope of equivalents to which such claims are entitled. Also, theterminology used herein is for the purpose of describing particularimplementations only, and is not intended to be limiting.

1. A method comprising: depositing an insulating layer on a substrate;forming a conductive polymer layer on the insulating layer; andrepeating deposition of a respective insulating layer, and formation ofa respective conductive polymer layer to form a multilayer stack ofrespective conductive polymer layers interposed between respectiveinsulating layers, wherein each respective conductive polymer layer hasa respective electrical resistance, and wherein the respectiveconductive polymer layers are electrically connected in parallel, suchthat a resultant electrical resistance of the respective conductivepolymer layers is less than each respective electrical resistance, andwherein repeating deposition of a respective insulating layer, andformation of a respective conductive polymer layer to form themultilayer stack comprises forming the multilayer stack to modifyelectrical resistivity over the substrate, such that a first location ofthe multilayer stack over the substrate has an electrical resistivitythat is different from a respective electrical resistivity at a secondlocation of the multilayer stack over the substrate.
 2. The method ofclaim 1, wherein repeating the deposition of the respective insulatinglayer and the formation of the respective conductive polymer layercomprises: repeating the deposition of the respective insulating layerand the formation of the respective conductive polymer layer until theresultant electrical resistance is substantially equal to apredetermined electrical resistance.
 3. The method of claim 1, whereinrepeating deposition of a respective insulating layer, and formation ofa respective conductive polymer layer to form a multilayer stackcomprises forming the multilayer stack to include each respectiveconductive polymer layer interfacing with two insulating layers, oneinsulating layer on each side of the respective conductive polymerlayer.
 4. The method of claim 1, further comprising: treating therespective conductive polymer layers with a conductivity enhancer toenhance electrical conductivity of the respective conductive polymerlayers.
 5. The method of claim 4, wherein treating the respectiveconductive polymer layers with the conductivity enhancer comprisestreating with a morphology enhancer or band modifier.
 6. The method ofclaim 1, further comprising: forming a first electrical contact on afirst edge of each conductive polymer layer; and forming a secondelectrical contact on a second edge of each conductive polymer layer,wherein the first electrical contact and the second electrical contactof the conductive polymer layers facilitate connecting the conductivepolymer layers to a power source.
 7. The method of claim 1, whereinforming the conductive polymer layer comprises forming the conductivepolymer layer to include an intrinsic or extrinsic conductive polymer.8. The method of claim 1, wherein depositing the insulating layercomprises depositing a resin layer including polyurethane, epoxy,thermoplastic, phenolic, or silicone material.
 9. The method of claim 1,wherein forming the conductive polymer layer comprises forming a layerof Polyaniline-Dinonylnaphthalene sulfonic acid (PANI-DNNSA),poly(ethylenedioxythiophene)-poly(styrenesulfonate) (PEDOT-PSS),Polyaniline-dodecylbenzene sulfonic acid (PANI-DBSA), polypyrrole,graphene paint, carbon nanotubes paint, carbon black, conductive oxide,or metallic particles.
 10. The method of claim 1, further comprising:curing the insulating layer prior to forming the conductive polymerlayer.
 11. (canceled)
 12. The method of claim 1, wherein forming themultilayer stack to modify the electrical resistivity over the substratecomprises depositing a different number of layers at different locationson the substrate.
 13. The method of claim 1, wherein forming themultilayer stack to modify the electrical resistivity over the substratecomprises depositing conductive polymer layers having a differentconductive polymer at different locations on the substrate.
 14. Themethod of claim 1, wherein forming the multilayer stack to modify theelectrical resistivity over the substrate comprises depositingconductive polymer layers having different thicknesses at differentlocations on the substrate.
 15. A device comprising: a substrate; and amultilayer stack disposed on the substrate, wherein the multilayer stackcomprises a plurality of conductive polymer layers, each conductivepolymer layer being interposed between respective insulating layers,wherein each conductive polymer layer has a respective electricalresistance, wherein the plurality of conductive polymer layers areelectrically connected in parallel, and wherein a number of conductivepolymer layers of the plurality of conductive polymer layers at a firstlocation over the substrate is different from a respective number ofconductive polymer layers of the plurality of conductive polymer layersat a second location in a longitudinal direction over the substrate,such that the first location over the substrate has an electricalresistivity that is different from a respective electrical resistivityat the second location over the substrate.
 16. The device of claim 15,wherein the conductive polymer layers are treated with a conductivityenhancer to enhance electrical conductivity of the conductive polymerlayers.
 17. The device of claim 16, wherein the conductivity enhancercomprises a morphology enhancer or band modifier.
 18. A component of anaircraft, the component comprising: a multilayer stack disposed on orproximate to a surface of the component, wherein the multilayer stackcomprises a plurality of conductive polymer layers, each conductivepolymer layer being interposed between respective insulating layers,wherein each conductive polymer layer has a respective electricalresistance, wherein the plurality of conductive polymer layers areelectrically connected in parallel to a power source, such that aresultant electrical resistance of the respective conductive polymerlayers is less than each respective electrical resistance, and wherein anumber of the conductive polymer layers of the multilayer stack at afirst location of the component is different from a number of theconductive polymer layers of the multilayer stack at a second locationin a longitudinal direction over the component so as to generate adifferent amount of heat at the first location compared to the secondlocation.
 19. The component of claim 18, wherein a number of conductivepolymer layers of the plurality of conductive polymer layers is selectedsuch that the resultant electrical resistance of the conductive polymerlayers is substantially equal to a predetermined electrical resistance.20. (canceled)
 21. A method comprising: depositing an insulating layeron a substrate; forming a conductive polymer layer on the insulatinglayer, wherein the conductive polymer layer comprises an intrinsicconductive polymer material made of Polyaniline-Dinonylnaphthalenesulfonic acid (PANI-DNNSA),poly(ethylenedioxythiophene)-poly(styrenesulfonate) (PEDOT-PSS), orPolyaniline-dodecylbenzene sulfonic acid (PANT-DBSA); and repeatingdeposition of a respective insulating layer, and formation of arespective conductive polymer layer to form a multilayer stack ofrespective conductive polymer layers interposed between respectiveinsulating layers, wherein each respective conductive polymer layer hasa respective electrical resistance, and wherein the respectiveconductive polymer layers are electrically connected in parallel, suchthat a resultant electrical resistance of the respective conductivepolymer layers is less than each respective electrical resistance.